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MBRS140LT3 Surface Mount Schottky Power Rectifier
SMB Power Surface Mount Package
This device employs the Schottky Barrier principle in a metal-to-silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes.
Features http://onsemi.com
SCHOTTKY BARRIER RECTIFIER 1.0 AMPERE - 40 VOLTS
* * * * * * * * * * *
Compact Package with J-Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Over-Voltage Protection Low Forward Voltage Drop Pb-Free Package is Available
SMB CASE 403A PLASTIC
Mechanical Characteristics:
Case: Molded Epoxy Epoxy Meets UL 94 V-0 @ 0.125 in Weight: 95 mg (Approximately) Cathode Polarity Band Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
MARKING DIAGRAM
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 110C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 100 kHz, TC = 110C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage / Operating Case Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25C) Symbol VRRM VRWM VR IO IFRM IFSM Value 40 Unit V
AYWW B14LG G
1.0 2.0 40
A A A
B14L = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
-55 to +150 -55 to +125 10,000 C C V/ms Device MBRS140LT3 MBRS140LT3G Package SMB SMB (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel
Tstg, TC TJ dv/dt
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2007
1
October, 2007 - Rev. 3
Publication Order Number: MBRS140LT3/D
MBRS140LT3
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction-to-Lead (Note 1) Thermal Resistance, Junction-to-Ambient (Note 2) 1. Mounted with minimum recommended pad size, PC Board FR4. 2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. Symbol RqJL RqJA Max 24 80 Unit C/W C/W
ELECTRICAL CHARACTERISTICS
Characteristic Maximum Instantaneous Forward Voltage (Note 3) see Figure 2 Maximum Instantaneous Reverse Current (Note 3) see Figure 4 3. Pulse Test: Pulse Width 250 ms, Duty Cycle 2.0%. (VR = 40 V) (VR = 20 V) IR (iF = 1.0 A) (iF = 2.0 A) Symbol vF TJ = 25C 0.5 0.6 TJ = 25C 0.4 0.02 TJ = 125C 0.425 0.58 TJ = 100C 10 5.0 mA Unit V
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MBRS140LT3
i F, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 100 100
10
10
1.0
TJ = 125C 100C
1.0
TJ = 125C 100C 25C
25C -40 C
0.1 0.1 0.3
0.1 0.1 0.3 0.5 0.7 0.9 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
0.5
0.7
0.9
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
IR , MAXIMUM REVERSE CURRENT (AMPS)
100E-3 IR , REVERSE CURRENT (AMPS) 10E-3 TJ = 125C 100C
100E-3 TJ = 125C 10E-3 1.0E-3 25C 100C
1.0E-3
100E-6 10E-6 25C 1.0E-6 0 10 20 30
100E-6
10E-6 1.0E-6
40
0
10
20
30
40
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
dc 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 25 45 65 85 105 125 TL, LEAD TEMPERATURE (C) SQUARE WAVE Ipk/Io = p Ipk/Io = 5.0 Ipk/Io = 10 Ipk/Io = 20 FREQ = 20 kHz
PFO , AVERAGE POWER DISSIPATION (WATTS)
IO , AVERAGE FORWARD CURRENT (AMPS)
1.6
0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 IO, AVERAGE FORWARD CURRENT (AMPS) Ipk/Io = p Ipk/Io = 5.0 Ipk/Io = 10 Ipk/Io = 20 SQUARE WAVE dc
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
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MBRS140LT3
TJ , DERATED OPERATING TEMPERATURE ( C) 1000 TJ = 25C C, CAPACITANCE (pF) 125 115 105 95 85 75 65 24C/W 44C/W
63C/W 80C/W Rtja = 94C/W
100
10 0 5.0 10 15 20 25 30 35 40 VR, REVERSE VOLTAGE (VOLTS)
0
5.0
10
15
20
25
30
35
40
VR, DC REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance
Figure 8. Typical Operating Temperature Derating*
R T, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating TJ may be calculated from the equation: TJ = TJmax - r(t)(Pf + Pr) where r(t) = thermal impedance under given conditions, Pf = forward power dissipation, and Pr = reverse power dissipation This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax - r(t)Pr, where r(t) = Rthja. For other power applications further calculations must be performed. 50% 20% 10% 5.0% 2.0% 1.0%
1.0E+00
1.0E-01
1.0E-02
1.0E-03 Rtjl(t) = Rtjl*r(t)
1.0E-04 0.00001 0.0001 0.001 0.01 0.1 t, TIME (s) 1.0 10 100 1000
R T, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
Figure 9. Thermal Response, Junction-to-Lead
50% 20% 10% 5.0% 2.0% 1.0%
1.0E+00
1.0E-01
1.0E-02
1.0E-03 Rtjl(t) = Rtjl*r(t)
1.0E-04 0.00001 0.0001 0.001 0.01 0.1 t, TIME (s) 1.0 10 100 1000
Figure 10. Thermal Response, Junction-to-Ambient http://onsemi.com
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MBRS140LT3
PACKAGE DIMENSIONS
SMB PLASTIC PACKAGE CASE 403A-03 ISSUE F
HE E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. DIM A A1 b c D E HE L L1 MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.13 2.45 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.096 0.008 0.087 0.012 0.156 0.181 0.220 0.063
b
D
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261 0.089
2.743 0.108
2.159 0.085
SCALE 8:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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MBRS140LT3/D

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